US Patent Issued to SAMSUNG ELECTRONICS on Feb. 4 for "Semiconductor package including adhesive layer and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,065, issued on Feb. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including adhesive layer and method for manufacturing the same" was invented by Yeohoon Yoon (Yongin-si, South Korea) and Ilho Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a first semiconductor chip, a second semiconductor chip spaced apart from the first semiconductor chip, an adhesive layer including an interposition portion and a side portion, and a molding layer. The molding layer may surround the first semiconductor chip, the second semiconductor chip, and the adh...