US Patent Issued to SAMSUNG ELECTRONICS on Feb. 4 for "Semiconductor package and method of forming the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,096, issued on Feb. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor package and method of forming the same" was invented by Yeongkwon Ko (Hwaseong-si, South Korea), Unbyoung Kang (Hwaseong-si, South Korea), Soyeon Kwon (Cheonan-si, South Korea), Yoonsung Kim (Seoul, South Korea) and Teakhoon Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of forming the same are provided. The semiconductor package includes: a semiconductor substrate having a front side and a back side, the semiconductor substrate having a chip area and a dummy area; a front structure below...