US Patent Issued to SAMSUNG ELECTRONICS on Feb. 4 for "Nonvolatile memory chip and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,219,774, issued on Feb. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Nonvolatile memory chip and semiconductor package including the same" was invented by Min Jae Lee (Suwon-si, South Korea), Jin Do Byun (Suwon-si, South Korea), Young-Hoon Son (Yongin-si, South Korea), Young Don Choi (Seoul, South Korea), Pan Suk Kwak (Seoul, South Korea), Myung Hun Lee (Seongnam-si, South Korea) and Jung Hwan Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A non-volatile memory chip comprises a cell region that includes a first surface, a second surface opposite to the first surface, a first cell structure, and ...