US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Semiconductor package with nanotwin copper bond pads" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,541, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package with nanotwin copper bond pads" was invented by Ju Bin Seo (Seongnam-si, South Korea), Su Jeong Park (Hwaseong-si, South Korea), Seok Ho Kim (Hwaseong-si, South Korea) and Kwang Jin Moon (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a first semiconductor substrate, a first semiconductor element layer on an upper surface of the first semiconductor substrate, a first wiring structure on the first semiconductor element layer, a first connecti...