US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,605, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Sungwoo Park (Suwon-si, South Korea), Yongjae Kim (Suwon-si, South Korea), Heonwoo Kim (Suwon-si, South Korea) and Seung-Kwan Ryu (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides semiconductor packages and methods of fabricating the same. In some embodiments, a semiconductor package includes a substrate including first and second regions, a first pad on the first region, a second pad on the second region, a first dielectric layer on ...