ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,580, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Youngbae Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a plurality of lower redistribution line patterns, a plurality of lower redistribution via patterns, and a lower redistribution insulating layer surrounding the plurality of lower redistribution line patterns and the plurality of lower redistribution via patterns; an expanded layer at least partially defining a mounting space and including, on the lower redistribution layer, a via pad at least partially d...