ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,603, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Keumhee Ma (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first semiconductor substrate, and a first upper pad arranged on an upper surface of the first semiconductor substrate, a first polymer layer arranged on the upper surface of the first semiconductor substrate, a second semiconductor chip mounted on the first semiconductor chip, the second semiconductor chip including a second semiconductor substrate and a second lower p...