US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,345, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Sangwon Baek (Suwon-si, South Korea), Beomjin Park (Suwon-si, South Korea), Myung Gil Kang (Suwon-si, South Korea), Dongwon Kim (Suwon-si, South Korea), Hyumin Yoo (Suwon-si, South Korea) and Namkyu Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns spaced apart from each other, a sour...