US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Dual connection circuit and electronic device including same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,569, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Dual connection circuit and electronic device including same" was invented by Namjun Cho (Suwon-si, South Korea), Jooseung Kim (Suwon-si, South Korea), Hyoseok Na (Suwon-si, South Korea) and Hyunseok Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the disclosure disclose a method and apparatus, comprising: a communication processor; a radio frequency integrated circuit (RFIC) connected to the communication processor and outputting at least one of a first radio frequency signal, a second radio frequency signal...