US Patent Issued to SAMSUNG ELECTRONICS on Feb. 3 for "Die alignment method using magnetic force" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,228, issued on Feb. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Die alignment method using magnetic force" was invented by Sumin Kim (Hwaseong-si, South Korea), Minwoo Rhee (Seoul, South Korea), Yongchul Shin (Hwaseong-si, South Korea), Ilyoung Han (Uiwang-si, South Korea), Nungpyo Hong (Goyang-si, South Korea), Seungdon Lee (Seongnam-si, South Korea) and Kyeongbin Lim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force ...