ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,297, issued on Feb. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Solder reflow apparatus and method of manufacturing an electronic device" was invented by Junga Lee (Suwon-si, South Korea), Youngja Kim (Suwon-si, South Korea), Hyunki Kim (Suwon-si, South Korea) and Youngmin Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage c...