US Patent Issued to SAMSUNG ELECTRONICS on Feb. 25 for "Semiconductor package and method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,240, issued on Feb. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing semiconductor package" was invented by Jinwoo Park (Seoul, South Korea), Jongho Lee (Hwaseong-si, South Korea), Yeongkwon Ko (Hwaseong-si, South Korea) and Teakhoon Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an interposer provided on the package substrate, a plurality of semiconductor devices on the interposer to be spaced apart from each other, the semiconductor devices being electrically connected to the package substr...