US Patent Issued to SAMSUNG ELECTRONICS on Feb. 25 for "Semiconductor package and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,253, issued on Feb. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method for fabricating the same" was invented by Jun Hyeong Park (Hwaseong-si, South Korea), Jin Young Kim (Suwon-si, South Korea) and Young Kwan Seo (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer having a pad insulating film, a first lower pad exposed from a lower surface of the pad insulating film, the first lower pad including a first extension and a second extension spaced apart from each other and extending side by side in a first direction, and a first ...