US Patent Issued to SAMSUNG ELECTRONICS on Feb. 25 for "Apparatus and method for SSP device and server to negotiate digital certificates" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,515, issued on Feb. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Apparatus and method for SSP device and server to negotiate digital certificates" was invented by Kangjin Yoon (Suwon-si, South Korea), Duckey Lee (Suwon-si, South Korea), Hyewon Lee (Suwon-si, South Korea) and Jonghoe Koo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of a local bundle assistant (LBA) negotiating a certificate with a secondary platform bundle manager (SPBM) in a wireless communication system including: transmitting a request message requesting information of certificates supported by a secondary secure plat...