ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,556, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package and method of fabricating the same" was invented by Jongyoun Kim (Seoul, South Korea), Minjun Bae (Hwaseong-si, South Korea), Hyeonseok Lee (Anyang-si, South Korea) and Gwangjae Jeon (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and their fabricating methods. The semiconductor package comprises a redistribution substrate, a semiconductor chip on a top surface of the redistribution substrate, and a solder terminal on a bottom surface of the redistribution substrate. The...