US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "Printed circuit board including conductive pad and electric device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,259, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Printed circuit board including conductive pad and electric device using the same" was invented by Bongsoo Kim (Gyeonggi-do, South Korea), Gyeongmin Jin (Gyeonggi-do, South Korea), Hakjoon Kim (Gyeonggi-do, South Korea) and Jaebum Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device according to an embodiment may include: a Printed Circuit Board (PCB) including a first face and a second face; a semiconductor chip mounted on the second face; a conductive pad disposed on the second face; a solder resist layer disp...