US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "Micro-semiconductor chip wetting alignment apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,525, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Micro-semiconductor chip wetting alignment apparatus" was invented by Kyungwook Hwang (Seoul, South Korea), Hyunjoon Kim (Seoul, South Korea), Joonyong Park (Suwon-si, South Korea), Seogwoo Hong (Yongin-si, South Korea) and Junsik Hwang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the t...