US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "Method and apparatus for compressing header to support highly reliable low-latency terminal in next generation mobile communication system" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,231,524, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for compressing header to support highly reliable low-latency terminal in next generation mobile communication system" was invented by Donggun Kim (Suwon-si, South Korea), Soenghun Kim (Suwon-si, South Korea), Anil Agiwal (Suwon-si, South Korea), Sangkyu Baek (Suwon-si, South Korea) and Jaehyuk Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a communication scheme and system for combining an IoT technology with a 5G communication system for supporting a higher data transfer r...