US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "Defect detection method of deep learning-based semiconductor device and semiconductor element manufacturing method including the defect detection method" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,229,944, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Defect detection method of deep learning-based semiconductor device and semiconductor element manufacturing method including the defect detection method" was invented by Kyenhee Lee (Seoul, South Korea), Mincheol Kang (Hwaseong-si, South Korea) and Sooryong Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a defect detection method of a semiconductor element, capable of promptly and accurately detecting a defect, and predicting a type of the defect with respect to various defects of the semiconductor e...