US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "CMP (chemical mechanical planarization) retaining ring" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. D1,062,662, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"CMP (chemical mechanical planarization) retaining ring" was invented by Hyungjoo Lee (Suwon-si, South Korea) and Hyeondong Song (Suwon-si, South Korea).

The patent was filed on June 15, 2023, under Application No. D/894,919.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1062662&OS=D1062662&RS=D1062662

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