US Patent Issued to SAMSUNG ELECTRONICS on Feb. 18 for "Chip-on-film package and display apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,576, issued on Feb. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip-on-film package and display apparatus including the same" was invented by Jaemin Jung (Seoul, South Korea), Jeongkyu Ha (Hwaseong-si, South Korea) and Sanguk Han (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base fil...