ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,712, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sunchul Kim (Suwon-si, South Korea), Junwoo Park (Suwon-si, South Korea), Hyunggil Baek (Suwon-si, South Korea), Yongkwan Lee (Suwon-si, South Korea) and Juhyung Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a lower substrate; a semiconductor chip disposed on the lower substrate; an upper substrate disposed on the semiconductor chip, having a lower surface facing the semiconductor chip, and including step structures disposed below the lower surface; a conne...