US Patent Issued to SAMSUNG ELECTRONICS on Feb. 11 for "Semiconductor devices and manufacturing methods of the same" (South Korean Inventor)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,225,725, issued on Feb. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices and manufacturing methods of the same" was invented by So Hyeon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a vertical stack of gate electrodes. The gate electrodes extend in different lengths to provide contact regions. The gate electrodes have a conductive region and an insulating region. Contact plugs fills contact holes that pass through the stack of gate electrodes in the contact regions. The contact plugs are connected to the gate electrodes. The contact plugs pass th...