ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,653, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing device and method for operating the same" was invented by Won Keun Cho (Suwon-si, South Korea), Dong Hoon Kwon (Suwon-si, South Korea) and Ki Hoon Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a ...