US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Stacked integrated circuit (IC) package" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,790, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Stacked integrated circuit (IC) package" was invented by Hun Seong Choi (Suwon-si, South Korea), Wooseok Chang (Suwon-si, South Korea), Junyeon Lee (Suwon-si, South Korea), Minkyu Kim (Suwon-si, South Korea), Byungwoo Bang (Suwon-si, South Korea) and Jiye Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first p...