US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,747, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Junghoon Kang (Anyang-si, South Korea), Jihye Shim (Hwaseong-si, South Korea), Jung Hyun Lee (Hwaseong-si, South Korea) and Hyunchul Jung (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a lower substrate, a lower semiconductor chip mounted on the lower substrate, a lower mold layer on the lower substrate and enclosing the lower semiconductor chip, a redistribution layer on the lower mold layer, and a vertical connection terminal...