ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,759, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Changbo Lee (Hwaseong-si, South Korea), Joonseok Oh (Seoul, South Korea), Youngmin Kim (Cheonan-si, South Korea), Jihye Shin (Cheonan-si, South Korea) and Hyundong Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution structure including a plurality of first redistribution layers and a plurality of first redistribution vias. A semiconductor chip is on the first redistribution structure. The semiconductor chip includes a chip pad. A connectio...