US Patent Issued to SAMSUNG ELECTRONICS on Feb. 10 for "Method for manufacturing semiconductor device and forming photoresist pattern" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,656, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for manufacturing semiconductor device and forming photoresist pattern" was invented by Jieun Lee (Suwon-si, South Korea), Jinpyoung Kim (Suwon-si, South Korea), Jieun Song (Suwon-si, South Korea), Janghoon Kim (Suwon-si, South Korea) and Woojin Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: forming a pattern formation material layer on a substrate; forming a photoresist on the pattern formation material layer; exposing and developing the photoresist to form a pho...