ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,846, issued on Feb. 10, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Fixing apparatus" was invented by Bongken Yu (Suwon-si, South Korea), Cheolsoo Han (Suwon-si, South Korea), Kwangjin Bae (Suwon-si, South Korea), Youngjin Jang (Suwon-si, South Korea), Inwook Jung (Suwon-si, South Korea) and Minchul Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an...