ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,439, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor packages having fixing members" was invented by Yongkwan Lee (Hwaseong-si, South Korea), Seunghwan Kim (Asan-si, South Korea), Jungjoo Kim (Suwon-si, South Korea), Jongwan Kim (Cheonan-si, South Korea), Junwoo Park (Asan-si, South Korea), Hyunggil Baek (Suwon-si, South Korea) and Junga Lee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes an interposer including an upper pad and an upper passivation layer partially covering the upper pad, a semiconductor chip disposed on the interposer, a c...