US Patent Issued to SAMSUNG ELECTRONICS on Dec. 9 for "Semiconductor package including stack structure of logic chip and sensing chips" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,633, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including stack structure of logic chip and sensing chips" was invented by Kyungkyu Kim (Suwon-si, South Korea), Dong-Hun Lee (Hwaseong-si, South Korea), Woonbae Kim (Seoul, South Korea), Daeho Lee (Hwaseong-si, South Korea) and Jungpil Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a substrate including a through hole, an image sensor structure on the substrate, and a first transparent substrate on the substrate and spaced apart from the image sensor structure may be pr...