US Patent Issued to SAMSUNG ELECTRONICS on Dec. 9 for "Semiconductor package and method of providing surface temperature of semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,406, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of providing surface temperature of semiconductor package" was invented by Sangmin An (Suwon-si, South Korea) and Sukyoung Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of providing a surface temperature of a semiconductor package including a semiconductor die that is packaged using a molding material includes setting an air temperature near the semiconductor package to each of reference temperatures, measuring reference code values respectively corresponding to the reference temperatures ...