ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,412, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kyoung Lim Suk (Suwon-si, South Korea), Bangweon Lee (Yongin-si, South Korea) and Seokhyun Lee (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate, a first molding layer on the package substrate and surrounding the first semiconductor chip, a redistribution layer on the first molding layer, a first through via that vertically penetrates the first molding layer and connects the package su...