US Patent Issued to SAMSUNG ELECTRONICS on Dec. 9 for "Overlay measurement method, semiconductor device manufacturing method using the same, and overlay measurement apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,246, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Overlay measurement method, semiconductor device manufacturing method using the same, and overlay measurement apparatus" was invented by Jaeil Lee (Hwaseong-si, South Korea) and Kyoungcho Na (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An overlay measurement method for accurately measuring and correcting an overlay in an environment in which a deep ultraviolet (DUV) apparatus and an extreme ultraviolet (EUV) apparatus are used together, a semiconductor device manufacturing method using the overlay measurement method, and an overla...