ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,504, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Ball attach tool" was invented by Hyeon Hwang (Suwon-si, South Korea) and Sangwon Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes."
The patent was filed on March 11, 2024, under Application No. 18/601,190.
*For further information, including images, charts and tables, please v...