US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Wafer dicing method and method of manufacturing semiconductor devices by using the wafer dicing method" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,369, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer dicing method and method of manufacturing semiconductor devices by using the wafer dicing method" was invented by Youngchul Kwon (Suwon-si, South Korea) and Deoksuk Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer dicing method includes preparing a wafer that includes a plurality of device forming regions and a scribe lane region that separates the plurality of device forming regions, forming a plurality of semiconductor devices in the plurality of device forming regions of the wafer, respectively, forming a pluralit...