US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Test board and test method for semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,510,584, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Test board and test method for semiconductor device using the same" was invented by Soonil Kwon (Suwon-si, South Korea), Seongseob Shin (Suwon-si, South Korea) and Dongho Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a test board which includes a substrate that includes a device under test (DUT) placement area where a first DUT and a second DUT are disposed, a first load switch connected in series with the first DUT and configured to be set to a switch on state or a switch off state based on a first enable signal...