ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,415, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package with barrier layer" was invented by Sanguk Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower surfaces of the frame and the inner semiconductor chip. The lower re-distribution layer has an opening therein which at least partially exposes the lower surface of the inner semiconductor chip. A lower semiconductor chi...