US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,398, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having semiconductor chip positioned in cavity of cover wiring structure" was invented by Choongbin Yim (Suwon-si, South Korea), Sungbum Kim (Suwon-si, South Korea), Jiyong Park (Suwon-si, South Korea), Jinwoo Park (Suwon-si, South Korea) and Jongbo Shim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a support wiring structure, a semiconductor chip on the support wiring structure, a cover wiring structure on the semiconductor chip, and a filling member filling betwee...