US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Semiconductor package and method of manufacture" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,442, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Semiconductor package and method of manufacture" was invented by Hwanwook Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a package substrate, a first chip mounted on the package substrate, a support frame pattern surrounding the first chip and defining a trench between the first chip and the support frame pattern, an adhesive film at least partially filling the trench, second semiconductor chips stacked on the support frame pattern, bonding wires connecting chip pads associated with the semiconductor chip...