ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,446, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Hyunsoo Chung (Hwaseong-si, South Korea), Younglyong Kim (Anyang-si, South Korea) and Inhyo Hwang (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a package redistribution layer, a cover insulating layer on the package redistribution layer; a lower semiconductor chip arranged between the package redistribution layer and the cover insulating layer and electrically connected to the package redistribution layer, a lower molding layer surrounding the lower semicondu...