ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,771, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor manufacturing method" was invented by Byung-Sun Park (Suwon-si, South Korea), Ik Soo Kim (Yongin-si, South Korea), Jiwoon Im (Hwaseong-si, South Korea), Sangho Rha (Seongnam-si, South Korea) and Minjae Oh (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus includes a chamber that includes a station in which a substrate is provided, a substrate holder that is in the station and receives the substrate, and lower showerheads below the substrate holder, the lower showerheads including a...