US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Semiconductor device including lower pads having different widths and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,427, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including lower pads having different widths and semiconductor package including the same" was invented by Jun Young Oh (Seoul, South Korea), Un-Byoung Kang (Hwaseong-Si, South Korea), Byeongchan Kim (Anyang-si, South Korea), Jumyong Park (Cheonan-si, South Korea) and Chungsun Lee (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor device may include a substrate, a first insulating layer on a bottom surface of the substrate, an interconnection structure in the first insulating layer, a second insula...