ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,315, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing semiconductor device" was invented by Jun Mo Park (Seoul, South Korea), Kyu Bong Choi (Seoul, South Korea), Yeon Ho Park (Seoul, South Korea), Eun Sil Park (Hwaseong-si, South Korea), Jin Seok Lee (Busan, South Korea), Wang Seop Lim (Cheonan-si, South Korea) and Kyung In Choi (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: forming first to third preliminary active patterns on a substrate to have different intervals therebetween, forming first and second fi...