ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,511,464, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of fabricating semiconductor device" was invented by Jonghwan Yu (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device includes designing a layout of the semiconductor device, performing a routing step using a routing tool, performing an optical proximity correction (OPC) on the designed layout, and performing a photolithography process on a substrate using a photomask manufactured by the layout corrected by the OPC. Performing the routing step includes generating and storing an XxY v...