US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Cover for module tray and module tray for semiconductor device including the same" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,351, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Cover for module tray and module tray for semiconductor device including the same" was invented by Taegeon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. The card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first brack...