ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,047, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package and cooling system" was invented by Jaechoon Kim (Incheon, South Korea), Taehwan Kim (Hwaseong-si, South Korea), Seunggeol Ryu (Seoul, South Korea), Eungchang Lee (Hanam-si, South Korea), Kiwook Jung (Suwon-si, South Korea) and Sungeun Jo (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a package substrate, an interposer disposed on the package substrate, semiconductor chips mounted on the interposer, a molding member on the interposer and surrounding the semiconductor chips, a...