ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,424, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kyung Don Mun (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes first and second semiconductor dies on a buffer die. The first semiconductor die includes first memory blocks on a first semiconductor substrate, a first interlayer dielectric layer, a first through via penetrating the first semiconductor substrate and connected to the buffer die, and first conductive pads on the first interlayer dielectric layer and connected to the first memory blocks. The second semi...