US Patent Issued to SAMSUNG ELECTRONICS on Dec. 23 for "Semiconductor devices and methods of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,077, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices and methods of fabricating the same" was invented by Jongchan Shin (Gwacheon-si, South Korea), Woojeong Shin (Suwon-si, South Korea), Changmin Park (Hwaseong-si, South Korea) and Noyoung Chung (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a logic cell on a substrate and a first metal layer on the logic cell. The first metal layer includes first and second power lines that extend in a first direction, and first, second, and third lower interconnection lines, which are respectiv...