ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,100, issued on Dec. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor chip" was invented by Seyeong Seok (Cheonan-si, South Korea), Dongwoo Kim (Cheonan-si, South Korea), Hosin Song (Hwaseong-si, South Korea) and Jonghyeon Chang (Pyeongtaek-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip that includes a chip body that has a first side surface, a second side surface, a third side surface, and a fourth side surface; a central region at a central portion of the chip body; and a peripheral region at a peripheral portion of the chip body and adjacent to at least one of the firs...